![]() The interconnect probe assembly can include a plurality of extending probes, wherein each pair of probes can be associated with its corresponding pair of ELG pads on the slider bar. The first extending probe is pre-loaded with a predetermined spring force in the direction of compression. The probe card is movable in a direction of compression between a first position in which the distal end of a first extending probe is spaced from a top surface of one of a first electronic lapping guide pad and a second position in which the distal end of the first extending probe contacts the top surface of the first electronic lapping guide pad. ![]() ![]() The lapping system also includes a probe card comprising at least one extending probe comprising a body member and a distal end. Such a lapping system includes a substrate comprising a surface to be lapped and at least one slider, wherein each slider includes at least one pair of electronic lapping guide pads. In one aspect of the present invention, a lapping system is provided that includes a bondingless interconnection structure and associated engagement scheme for more secure contact between a probe tip and an ELG pad to survive the “touchdown” and lapping processes. There is a need to provide a probe structure and attachment procedure which will result in desirable, robust contact between the probe tip and the corresponding ELG pad, yet not be cost prohibitive. When a probe card with extending probes is used during the lapping process, such a movement of the electronic lapping guides can cause poor contact between the probes and their respective ELG pads. Because the row bar is typically attached to a carrier via an adhesive (e.g., a hot melt glue), the touchdown process induces compression of the adhesive, which can cause undesirable movement of the electronic lapping guide (ELG) pads. This part of the process can be referred to as the “touchdown”. In order to start a lapping process, the front surface of the bar is brought into contact with the abrasive surface of the lapping plate. Conversely, the kiss lapping step is a final polishing and precision shaping step, which is much less aggressive than the rough lapping step. The rough lapping step is a relatively aggressive lapping process that requires good adhesion of the slider bar to the lapping carrier in order to avoid the bar being sheared off the carrier during the rough lapping process. To achieve the desired precise dimensions prior to the formation of the air bearing surface, the lapping process is typically a multiple step process, which begins with a double-sided lapping (DSL) step, followed by a “rough lapping” step, which is followed by an intermediate “fine lapping” step, and then the process can be completed with a polishing step, often called “kiss lapping” step. For example, the lapping process can be controlled to cease when the electronic lapping guide resistance reaches a predetermined value associated with a desired stripe height of the transducer element. Thus, monitoring of the electronic lapping guide resistance during lapping permits very fine adaptive control of the stripe height of the transducer element. The electrical resistance of the electronic lapping guide is inversely proportional to the area of the cross-section of an imbedded sensor. The wafer substrate is then sliced into rows and then lapped prior to formation of the air bearing surface. ![]() To achieve precise and accurate control of the depth to which the sensing element is lapped, an electronic lapping guide is typically included on the wafer substrate with the sensing element during manufacture. This is accomplished by lapping the bar sliced off the wafer substrate on which the magnetic read head is constructed. The bars are then subjected to a series of processes to form individual sliders, including lapping, cleaning, formation of air-bearing surfaces (ABS), and dicing.ĭuring construction, the air bearing surface is precisely defined so that the sensing element has a precise stripe height, which is the distance between the air bearing surface and the back edge. In a typical process, an array of sliders are formed on a common substrate or an AlTiC wafer which is then sliced to produce bars, with a row of sliders in a side-by-side pattern on each bar. The transducing heads are typically produced by using thin film deposition techniques. The slider is carried by an arm assembly that includes an actuator arm and a suspension assembly, which can include a separate gimbal structure or can integrally form a gimbal. A transducing head carried by a slider is used to read from and write to a data track on a disc. Hard disc drive systems (HDDs) typically include one or more data storage discs.
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